Samsung Galaxy S7 Rumors: Device For U.S., China To Deliver Monstrous Performance, Release Date Predicted As February 2016

The Samsung Galaxy S7 is expected to arrive in two CPU variants, namely the Snapdragon 820 chipset and the Exynos 8890 SoC. Fresh information claims that the Galaxy S7 that will be available in the U.S. and China will be powered by Snapdragon chip whereas the Galaxy S7 for other regions will be featuring the Exynos chip.

According to Reuters, the Galaxy S6 variants that were released this year feature Exynos processors. However, earlier this year, the South Korean company had said that it will be using Qualcomm chips for its forthcoming smartphones.

It was because of the thermal overheating problems of the Snapdragon 810 chipset that Samsung refrained from using it on its 2015 flagship smartphones, Phone Arena reported. The Snapdragon 820 features quad-core processor with Kyro cores along with Adreno 530 graphics.

Built with 14 nm FinFET manufacturing process, the SD 820 will consume less power and deliver enhanced thermal management. It is capable of reaching a maximum processing speed of up to 3 GHz per core. The Exynos 8890 is also referred with different names like Exynos M1, or Mongoose.

Early speculations indicate that two versions of the Galaxy S7 will be released, one featuring a 5.2-inch display along with 3 GB of RAM and the other one featuring a 5.8-inch display and 4 GB of RAM, G for Games reported. Both the handsets will be available in native storage editions of 32 GB and 64 GB.

Except for the Galaxy S6, all the previous Galaxy S series handsets came with microSD slot. Rumors have it that the microSD slot will available on the Galaxy S7 handsets as well. The upcoming Galaxy S7 variants are expected to arrive with metal unibody chassis.

Since the Galaxy Note 5 was released earlier than its usual release pattern, the Galaxy S7 is also expected to release early next year. Rumors suggest that Galaxy S7 release date will be set in February 2016.