Samsung Galaxy S8, S8+ With Bottom Headphone Jack, Top SIM Card Tray Exposed In New Leaked Photos
The remaining days until Samsung officially introduces the Galaxy S8 and Galaxy S8+ to the world are already numbered. Prior the South Korea giant’s big launch event on March 29, however, more leaks featuring the highly anticipated smartphones continue to surface online.
Just this Tuesday, Slashleaks shared several real life images of the Galaxy S7 and S7 edge’s successors. This new batch of leaked photos appears to be very legit since they were obtained by the publication from a screen protector manufacturer that released the pictures on condition of anonymity to avoid any retaliation from Apple’s biggest rival.
One photo shows the Galaxy S8 and the Galaxy S8+ side by side. What’s very obvious right away upon looking at this photo is the similarity in their form design factor despite the difference in their sizes. The screen on the S8+ is on, so the on-screen home button is very conspicuous.
Other images show close-up shots of the S8’s top and bottom. By the looks of it, the SIM card tray is situated atop the device, while the headphone jack is found at the bottom, alongside the USB-C charging port, microphone and speaker grille.
The leaked photos also confirm that both the S8 and S8+ will sport curved, edge-to-edge displays and very thin top and bottom bezels. The curved sides of the handsets also help in ensuring that there are no bezels on the left and right side of the phones.
According to Android Headlines, the Galaxy S8 will come with a 5.8-inch QHD Super AMOLED display. On the other hand, the S8+ is rocking the same QHD panel that’s significantly larger at 6.2 inches. When it comes to performance, fans can only expect the best from both devices. They are said to house Qualcomm’s Snapdragon 835 SoC and 4GB of RAM. They will run Android Nougat out of the box.
Meanwhile, Forbes has learned that instead of the rumored same-day release of the smartphones on the market, Samsung is planning to put the handsets on sale on April 1.
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